Analytical heat transfer model for thermal through-silicon vias
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Hu Xu, Vasilis F. Pavlidis, Giovanni De Micheli
Analytical heat transfer model for thermal through-silicon vias
DATE, 2011.

DATE 2011
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@inproceedings{DATE-2011-XuPM,
	author        = "Hu Xu and Vasilis F. Pavlidis and Giovanni De Micheli",
	booktitle     = "{Proceedings of the 15th Conference on Design, Automation and Test in Europe}",
	isbn          = "978-1-61284-208-0",
	pages         = "395--400",
	publisher     = "{IEEE}",
	title         = "{Analytical heat transfer model for thermal through-silicon vias}",
	year          = 2011,
}


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