BibSLEIGH — An efficient leakage-aware thermal simulation approach for 3D-ICs using corrected linearized model and algebraic multigrid

Chao Yan, Hengliang Zhu, Dian Zhou, Xuan Zeng 0001
An efficient leakage-aware thermal simulation approach for 3D-ICs using corrected linearized model and algebraic multigrid
DATE, 2017.

DATE 2017

@inproceedings{DATE-2017-YanZZZ,
	author        = "Chao Yan and Hengliang Zhu and Dian Zhou and Xuan Zeng 0001",
	booktitle     = "{Proceedings of the 21st Conference and Exhibition on Design, Automation and Test in Europe}",
	doi           = "10.23919/DATE.2017.7927172",
	isbn          = "978-3-9815370-8-6",
	pages         = "1207--1212",
	publisher     = "{IEEE}",
	title         = "{An efficient leakage-aware thermal simulation approach for 3D-ICs using corrected linearized model and algebraic multigrid}",
	year          = 2017,
}

Chao Yan, Hengliang Zhu, Dian Zhou, Xuan Zeng 0001An efficient leakage-aware thermal simulation approach for 3D-ICs using corrected linearized model and algebraic multigridDATE, 2017.

Chao Yan, Hengliang Zhu, Dian Zhou, Xuan Zeng 0001
An efficient leakage-aware thermal simulation approach for 3D-ICs using corrected linearized model and algebraic multigrid
DATE, 2017.