General floorplanning methodology for 3D ICs with an arbitrary bonding style
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Jai-Ming Lin, Chien-Yu Huang
General floorplanning methodology for 3D ICs with an arbitrary bonding style
DATE, 2018.

DATE 2018
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@inproceedings{DATE-2018-LinH,
	author        = "Jai-Ming Lin and Chien-Yu Huang",
	booktitle     = "{Proceedings of the 22nd Conference and Exhibition on Design, Automation and Test in Europe}",
	doi           = "10.23919/DATE.2018.8342197",
	isbn          = "978-3-9819263-0-9",
	pages         = "1199--1202",
	publisher     = "{IEEE}",
	title         = "{General floorplanning methodology for 3D ICs with an arbitrary bonding style}",
	year          = 2018,
}


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