4 papers:
DAC-2012-JungPL #3d #reliability- Chip/package co-analysis of thermo-mechanical stress and reliability in TSV-based 3D ICs (MJ, DZP, SKL), pp. 317–326.
KDD-2011-LiLLNTF #cyber-physical #named- ThermoCast: a cyber-physical forecasting model for datacenters (LL, CJML, JL, SN, AT, CF), pp. 1370–1378.
HPCA-2007-ChoiKSSWL #modelling- Modeling and Managing Thermal Profiles of Rack-mounted Servers with ThermoStat (JC, YK, AS, JS, QW, JL), pp. 205–215.
ICPR-v4-2006-KyweYM #lens #using- Contact Lens Extraction by Using Thermo-Vision (WWK, MY, KM), pp. 570–573.
