- DAC-2012-JungPL #3d #reliability
- Chip/package co-analysis of thermo-mechanical stress and reliability in TSV-based 3D ICs (MJ, DZP, SKL), pp. 317–326.
- KDD-2011-LiLLNTF #cyber-physical #named
- ThermoCast: a cyber-physical forecasting model for datacenters (LL, CJML, JL, SN, AT, CF), pp. 1370–1378.
- HPCA-2007-ChoiKSSWL #modelling
- Modeling and Managing Thermal Profiles of Rack-mounted Servers with ThermoStat (JC, YK, AS, JS, QW, JL), pp. 205–215.
- ICPR-v4-2006-KyweYM #lens #using
- Contact Lens Extraction by Using Thermo-Vision (WWK, MY, KM), pp. 570–573.