M. Inui, Y. Ebina, T. Maezaki, L. Zhou
Geometric Simulation of Infeed Grinding Process of Silicon Wafer Using GPU
CASE, 2018.
@inproceedings{CASE-2018-InuiEMZ,
author = "M. Inui and Y. Ebina and T. Maezaki and L. Zhou",
booktitle = "{Proceedings of the 14th International Conference on Automation Science and Engineering}",
doi = "10.1109/COASE.2018.8560519",
isbn = "978-1-5386-3593-3",
pages = "1519--1524",
publisher = "{IEEE}",
title = "{Geometric Simulation of Infeed Grinding Process of Silicon Wafer Using GPU}",
year = 2018,
}











