Jia-Wei Fang, Martin D. F. Wong, Yao-Wen Chang
Flip-chip routing with unified area-I/O pad assignments for package-board co-design
DAC, 2009.
@inproceedings{DAC-2009-FangWC,
author = "Jia-Wei Fang and Martin D. F. Wong and Yao-Wen Chang",
booktitle = "{Proceedings of the 46th Design Automation Conference}",
doi = "10.1145/1629911.1630002",
isbn = "978-1-60558-497-3",
pages = "336--339",
publisher = "{ACM}",
title = "{Flip-chip routing with unified area-I/O pad assignments for package-board co-design}",
year = 2009,
}











