## Wenwen Chai, Dan Jiao

*Direct matrix solution of linear complexity for surface integral-equation based impedance extraction of high bandwidth interconnects*

DAC, 2011.

@inproceedings{DAC-2011-ChaiJ, author = "Wenwen Chai and Dan Jiao", booktitle = "{Proceedings of the 48th Design Automation Conference}", doi = "10.1145/2024724.2024770", isbn = "978-1-4503-0636-2", pages = "206--211", publisher = "{ACM}", title = "{Direct matrix solution of linear complexity for surface integral-equation based impedance extraction of high bandwidth interconnects}", year = 2011, }