Travelled to:
2 × USA
Collaborated with:
D.Jiao C.Koh
Talks about:
extract (2) complex (2) linear (2) integr (2) direct (2) imped (2) equat (2) interconnect (1) bandwidth (1) capacit (1)
Person: Wenwen Chai
DBLP: Chai:Wenwen
Contributed to:
Wrote 2 papers:
- DAC-2011-ChaiJ #complexity #equation #linear #matrix
- Direct matrix solution of linear complexity for surface integral-equation based impedance extraction of high bandwidth interconnects (WC, DJ), pp. 206–211.
- DAC-2009-ChaiJK #3d #complexity #equation #linear #scalability
- A direct integral-equation solver of linear complexity for large-scale 3D capacitance and impedance extraction (WC, DJ, CKK), pp. 752–757.