Xiaodong Liu, Yifan Zhang, Gary K. Yeap, Xuan Zeng
An integrated algorithm for 3D-IC TSV assignment
DAC, 2011.
@inproceedings{DAC-2011-LiuZYZ,
author = "Xiaodong Liu and Yifan Zhang and Gary K. Yeap and Xuan Zeng",
booktitle = "{Proceedings of the 48th Design Automation Conference}",
doi = "10.1145/2024724.2024873",
isbn = "978-1-4503-0636-2",
pages = "652--657",
publisher = "{ACM}",
title = "{An integrated algorithm for 3D-IC TSV assignment}",
year = 2011,
}











