An integrated algorithm for 3D-IC TSV assignment
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Xiaodong Liu, Yifan Zhang, Gary K. Yeap, Xuan Zeng
An integrated algorithm for 3D-IC TSV assignment
DAC, 2011.

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@inproceedings{DAC-2011-LiuZYZ,
	author        = "Xiaodong Liu and Yifan Zhang and Gary K. Yeap and Xuan Zeng",
	booktitle     = "{Proceedings of the 48th Design Automation Conference}",
	doi           = "10.1145/2024724.2024873",
	isbn          = "978-1-4503-0636-2",
	pages         = "652--657",
	publisher     = "{ACM}",
	title         = "{An integrated algorithm for 3D-IC TSV assignment}",
	year          = 2011,
}

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