Adaptive chip-package thermal analysis for synthesis and design
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Yonghong Yang, Zhenyu (Peter) Gu, Changyun Zhu, Li Shang, Robert P. Dick
Adaptive chip-package thermal analysis for synthesis and design
DATE, 2006.

DATE 2006
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@inproceedings{DATE-2006-YangGZSD,
	author        = "Yonghong Yang and Zhenyu (Peter) Gu and Changyun Zhu and Li Shang and Robert P. Dick",
	booktitle     = "{Proceedings of the 10th Conference on Design, Automation and Test in Europe}",
	doi           = "10.1145/1131720",
	pages         = "844--849",
	publisher     = "{European Design and Automation Association, Leuven, Belgium}",
	title         = "{Adaptive chip-package thermal analysis for synthesis and design}",
	year          = 2006,
}

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