Testing TSV-based three-dimensional stacked ICs
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Erik Jan Marinissen
Testing TSV-based three-dimensional stacked ICs
DATE, 2010.

DATE 2010
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@inproceedings{DATE-2010-Marinissen,
	author        = "Erik Jan Marinissen",
	booktitle     = "{Proceedings of the 14th Conference on Design, Automation and Test in Europe}",
	pages         = "1689--1694",
	publisher     = "{IEEE}",
	title         = "{Testing TSV-based three-dimensional stacked ICs}",
	year          = 2010,
}

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