Erik Jan Marinissen
Challenges and emerging solutions in testing TSV-based 2 1 over 2D- and 3D-stacked ICs
DATE, 2012.
@inproceedings{DATE-2012-Marinissen, acmid = "2493023", author = "Erik Jan Marinissen", booktitle = "{Proceedings of the 16th Conference and Exhibition on Design, Automation and Test in Europe}", isbn = "978-1-4577-2145-8", pages = "1277--1282", publisher = "{IEEE}", title = "{Challenges and emerging solutions in testing TSV-based 2 1 over 2D- and 3D-stacked ICs}", year = 2012, }