Electrothermal simulation of bonding wire degradation under uncertain geometries
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Thorben Casper, Herbert De Gersem, Renaud Gillon, Tomás Gotthans, Tomas Kratochvil, Peter Meuris, Sebastian Schöps
Electrothermal simulation of bonding wire degradation under uncertain geometries
DATE, 2016.

DATE 2016
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@inproceedings{DATE-2016-CasperGGGKMS,
	author        = "Thorben Casper and Herbert De Gersem and Renaud Gillon and Tomás Gotthans and Tomas Kratochvil and Peter Meuris and Sebastian Schöps",
	booktitle     = "{Proceedings of the 20th Conference and Exhibition on Design, Automation and Test in Europe}",
	ee            = "http://ieeexplore.ieee.org/document/7459510/",
	isbn          = "978-3-9815-3707-9",
	pages         = "1297--1302",
	publisher     = "{IEEE}",
	title         = "{Electrothermal simulation of bonding wire degradation under uncertain geometries}",
	year          = 2016,
}


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