ATHENIS_3D: Automotive tested high-voltage and embedded non-volatile integrated SoC platform with 3D technology
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E. Wachmann, Sergio Saponara, C. Zambelli, Pierre Tisserand, J. Charbonnier, Tobias Erlbacher, S. Gruenler, C. Hartler, J. Siegert, Pierre Chassard, D. M. Ton, Lorenzo Ferrari, Luca Fanucci
ATHENIS_3D: Automotive tested high-voltage and embedded non-volatile integrated SoC platform with 3D technology
DATE, 2016.

DATE 2016
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@inproceedings{DATE-2016-WachmannSZTCEGH,
	author        = "E. Wachmann and Sergio Saponara and C. Zambelli and Pierre Tisserand and J. Charbonnier and Tobias Erlbacher and S. Gruenler and C. Hartler and J. Siegert and Pierre Chassard and D. M. Ton and Lorenzo Ferrari and Luca Fanucci",
	booktitle     = "{Proceedings of the 20th Conference and Exhibition on Design, Automation and Test in Europe}",
	ee            = "http://ieeexplore.ieee.org/document/7459435/",
	isbn          = "978-3-9815-3707-9",
	pages         = "894--899",
	publisher     = "{IEEE}",
	title         = "{ATHENIS_3D: Automotive tested high-voltage and embedded non-volatile integrated SoC platform with 3D technology}",
	year          = 2016,
}


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