@inproceedings{DATE-2017-WangZTT,
	author        = "Shengcheng Wang and Hengyang Zhao and Sheldon X.-D. Tan and Mehdi Baradaran Tahoori",
	booktitle     = "{Proceedings of the 21st Conference and Exhibition on Design, Automation and Test in Europe}",
	doi           = "10.23919/DATE.2017.7926986",
	isbn          = "978-3-9815370-8-6",
	pages         = "220--225",
	publisher     = "{IEEE}",
	title         = "{Recovery-aware proactive TSV repair for electromigration in 3D ICs}",
	year          = 2017,
}