Travelled to:
1 × Germany
Collaborated with:
F.Firouzi F.Oboril M.B.Tahoori
Talks about:
reduct (1) plan (1) drop (1) tsv (1)
Person: Shengcheng Wang
DBLP: Wang:Shengcheng
Contributed to:
Wrote 1 papers:
- DATE-2014-WangFOT #3d #reduction
- P/G TSV planning for IR-drop reduction in 3D-ICs (SW, FF, FO, MBT), pp. 1–6.