Low-power 3D integration using inductive coupling links for neurotechnology applications
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Benjamin J. Fletcher, Shidhartha Das, Chi-Sang Poon, Terrence S. T. Mak
Low-power 3D integration using inductive coupling links for neurotechnology applications
DATE, 2018.

DATE 2018
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@inproceedings{DATE-2018-FletcherDPM,
	author        = "Benjamin J. Fletcher and Shidhartha Das and Chi-Sang Poon and Terrence S. T. Mak",
	booktitle     = "{Proceedings of the 22nd Conference and Exhibition on Design, Automation and Test in Europe}",
	doi           = "10.23919/DATE.2018.8342200",
	isbn          = "978-3-9819263-0-9",
	pages         = "1211--1216",
	publisher     = "{IEEE}",
	title         = "{Low-power 3D integration using inductive coupling links for neurotechnology applications}",
	year          = 2018,
}


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