Benjamin J. Fletcher, Shidhartha Das, Chi-Sang Poon, Terrence S. T. Mak
Low-power 3D integration using inductive coupling links for neurotechnology applications
DATE, 2018.
@inproceedings{DATE-2018-FletcherDPM,
author = "Benjamin J. Fletcher and Shidhartha Das and Chi-Sang Poon and Terrence S. T. Mak",
booktitle = "{Proceedings of the 22nd Conference and Exhibition on Design, Automation and Test in Europe}",
doi = "10.23919/DATE.2018.8342200",
isbn = "978-3-9819263-0-9",
pages = "1211--1216",
publisher = "{IEEE}",
title = "{Low-power 3D integration using inductive coupling links for neurotechnology applications}",
year = 2018,
}