Seungwon Kim, Ki Jin Han, Youngmin Kim, Seokhyeong Kang
Fast chip-package-PCB coanalysis methodology for power integrity of multi-domain high-speed memory: A case study
DATE, 2018.
@inproceedings{DATE-2018-KimHKK,
author = "Seungwon Kim and Ki Jin Han and Youngmin Kim and Seokhyeong Kang",
booktitle = "{Proceedings of the 22nd Conference and Exhibition on Design, Automation and Test in Europe}",
doi = "10.23919/DATE.2018.8342132",
isbn = "978-3-9819263-0-9",
pages = "885--888",
publisher = "{IEEE}",
title = "{Fast chip-package-PCB coanalysis methodology for power integrity of multi-domain high-speed memory: A case study}",
year = 2018,
}