Ting-You Lin, Chauchin Su, Chung-Chih Hung, Karuna Nidhi, Chily Tu, Shao-Chang Huang
Package and Chip Accelerated Aging Methods for Power MOSFET Reliability Evaluation
DATE, 2019.
@inproceedings{DATE-2019-LinSHNTH,
author = "Ting-You Lin and Chauchin Su and Chung-Chih Hung and Karuna Nidhi and Chily Tu and Shao-Chang Huang",
booktitle = "{Proceedings of the 23rd Conference and Exhibition on Design, Automation and Test in Europe}",
doi = "10.23919/DATE.2019.8714895",
isbn = "978-3-9819263-2-3",
pages = "1661--1666",
publisher = "{IEEE}",
title = "{Package and Chip Accelerated Aging Methods for Power MOSFET Reliability Evaluation}",
year = 2019,
}