Travelled to:
1 × USA
Collaborated with:
G.Woods S.Reda
Talks about:
throughput (1) character (1) thermal (1) integr (1) test (1) high (1) use (1) tsv (1) map (1)
Person: Kapil Dev
DBLP: Dev:Kapil
Contributed to:
Wrote 1 papers:
- DAC-2013-DevWR #3d #integration #testing #using
- High-throughput TSV testing and characterization for 3D integration using thermal mapping (KD, GW, SR), p. 6.