Robust TSV-based 3D NoC design to counteract electromigration and crosstalk noise
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Sourav Das, Janardhan Rao Doppa, Partha Pratim Pande, Krishnendu Chakrabarty
Robust TSV-based 3D NoC design to counteract electromigration and crosstalk noise
DATE, 2017.

DATE 2017
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@inproceedings{DATE-2017-DasDPC,
	author        = "Sourav Das and Janardhan Rao Doppa and Partha Pratim Pande and Krishnendu Chakrabarty",
	booktitle     = "{Proceedings of the 21st Conference and Exhibition on Design, Automation and Test in Europe}",
	doi           = "10.23919/DATE.2017.7927205",
	isbn          = "978-3-9815370-8-6",
	pages         = "1366--1371",
	publisher     = "{IEEE}",
	title         = "{Robust TSV-based 3D NoC design to counteract electromigration and crosstalk noise}",
	year          = 2017,
}


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