Sourav Das, Janardhan Rao Doppa, Partha Pratim Pande, Krishnendu Chakrabarty
Robust TSV-based 3D NoC design to counteract electromigration and crosstalk noise
DATE, 2017.
@inproceedings{DATE-2017-DasDPC,
author = "Sourav Das and Janardhan Rao Doppa and Partha Pratim Pande and Krishnendu Chakrabarty",
booktitle = "{Proceedings of the 21st Conference and Exhibition on Design, Automation and Test in Europe}",
doi = "10.23919/DATE.2017.7927205",
isbn = "978-3-9815370-8-6",
pages = "1366--1371",
publisher = "{IEEE}",
title = "{Robust TSV-based 3D NoC design to counteract electromigration and crosstalk noise}",
year = 2017,
}