Capacitance of TSVs in 3-D stacked chips a problem?: not for neuromorphic systems!
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Antoine Joubert, Marc Duranton, Bilel Belhadj, Olivier Temam, Rodolphe Héliot
Capacitance of TSVs in 3-D stacked chips a problem?: not for neuromorphic systems!
DAC, 2012.

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@inproceedings{DAC-2012-JoubertDBTH,
	author        = "Antoine Joubert and Marc Duranton and Bilel Belhadj and Olivier Temam and Rodolphe Héliot",
	booktitle     = "{Proceedings of the 49th Annual Design Automation Conference}",
	doi           = "10.1145/2228360.2228595",
	isbn          = "978-1-4503-1199-1",
	pages         = "1264--1265",
	publisher     = "{ACM}",
	title         = "{Capacitance of TSVs in 3-D stacked chips a problem?: not for neuromorphic systems!}",
	year          = 2012,
}

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