Kyungsu Kang, Sangho Park, Jong-Bae Lee, Luca Benini, Giovanni De Micheli
A power-efficient 3-D on-chip interconnect for multi-core accelerators with stacked L2 cache
DATE, 2016.
@inproceedings{DATE-2016-KangPLBM,
author = "Kyungsu Kang and Sangho Park and Jong-Bae Lee and Luca Benini and Giovanni De Micheli",
booktitle = "{Proceedings of the 20th Conference and Exhibition on Design, Automation and Test in Europe}",
ee = "http://ieeexplore.ieee.org/document/7459541/",
isbn = "978-3-9815-3707-9",
pages = "1465--1468",
publisher = "{IEEE}",
title = "{A power-efficient 3-D on-chip interconnect for multi-core accelerators with stacked L2 cache}",
year = 2016,
}
