Ran Wang 0002, Zipeng Li, Sukeshwar Kannan, Krishnendu Chakrabarty
Pre-bond testing of the silicon interposer in 2.5D ICs
DATE, 2016.
@inproceedings{DATE-2016-WangLKC,
	author        = "Ran Wang 0002 and Zipeng Li and Sukeshwar Kannan and Krishnendu Chakrabarty",
	booktitle     = "{Proceedings of the 20th Conference and Exhibition on Design, Automation and Test in Europe}",
	ee            = "http://ieeexplore.ieee.org/document/7459449/",
	isbn          = "978-3-9815-3707-9",
	pages         = "978--983",
	publisher     = "{IEEE}",
	title         = "{Pre-bond testing of the silicon interposer in 2.5D ICs}",
	year          = 2016,
}