Ran Wang 0002, Zipeng Li, Sukeshwar Kannan, Krishnendu Chakrabarty
Pre-bond testing of the silicon interposer in 2.5D ICs
DATE, 2016.
@inproceedings{DATE-2016-WangLKC,
author = "Ran Wang 0002 and Zipeng Li and Sukeshwar Kannan and Krishnendu Chakrabarty",
booktitle = "{Proceedings of the 20th Conference and Exhibition on Design, Automation and Test in Europe}",
ee = "http://ieeexplore.ieee.org/document/7459449/",
isbn = "978-3-9815-3707-9",
pages = "978--983",
publisher = "{IEEE}",
title = "{Pre-bond testing of the silicon interposer in 2.5D ICs}",
year = 2016,
}