Travelled to:2 × USA
Collaborated with:W.R.Davis H.Hua C.Mineo K.Schoenfliess A.M.Sule R.Jenkal P.D.Franzon M.B.Steer S.Lipa E.C.Oh T.Thorolfsson S.Luniya T.Doxsee S.Berkeley B.Shani K.Obermiller
Talks about:circuit (2) integr (2) temperatur (1) dimension (1) compromis (1) explor (1) design (1) three (1) power (1) among (1)
Person: Samson Melamed
DBLP: Melamed:Samson
Contributed to:
20082006Wrote 2 papers:
- DAC-2008-FranzonDSLOTMLDBSO #3d #design
- Design and CAD for 3D integrated circuits (PDF, WRD, MBS, SL, ECO, TT, SM, SL, TD, SB, BS, KO), pp. 668–673.
- DAC-2006-HuaMSSMJD #3d
- Exploring compromises among timing, power and temperature in three-dimensional integrated circuits (HH, CM, KS, AMS, SM, RJ, WRD), pp. 997–1002.