A Boundary-Element Approach to Transient simulation of Three-Dimensional Integrated Circuit Interconnect
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David D. Ling, S. Kim, J. White
A Boundary-Element Approach to Transient simulation of Three-Dimensional Integrated Circuit Interconnect
DAC, 1992.

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@inproceedings{DAC-1992-LingKW,
	acmid         = "113938.110423",
	author        = "David D. Ling and S. Kim and J. White",
	booktitle     = "{Proceedings of the 29th Design Automation Conference}",
	isbn          = "0-8186-2822-7",
	pages         = "93--98",
	publisher     = "{IEEE Computer Society Press}",
	title         = "{A Boundary-Element Approach to Transient simulation of Three-Dimensional Integrated Circuit Interconnect}",
	year          = 1992,
}

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