Small delay testing for TSVs in 3-D ICs
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Shi-Yu Huang, Yu-Hsiang Lin, Kun-Han Tsai, Wu-Tung Cheng, Stephen K. Sunter, Yung-Fa Chou, Ding-Ming Kwai
Small delay testing for TSVs in 3-D ICs
DAC, 2012.

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@inproceedings{DAC-2012-HuangLTCSCK,
	author        = "Shi-Yu Huang and Yu-Hsiang Lin and Kun-Han Tsai and Wu-Tung Cheng and Stephen K. Sunter and Yung-Fa Chou and Ding-Ming Kwai",
	booktitle     = "{Proceedings of the 49th Annual Design Automation Conference}",
	doi           = "10.1145/2228360.2228546",
	isbn          = "978-1-4503-1199-1",
	pages         = "1031--1036",
	publisher     = "{ACM}",
	title         = "{Small delay testing for TSVs in 3-D ICs}",
	year          = 2012,
}

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