Travelled to:
1 × France
2 × USA
Collaborated with:
C.Lung Y.Ho S.Chang H.Chang J.Huang K.(.Cheng C.Wu S.Huang Y.Lin K.Tsai W.Cheng S.K.Sunter Y.Chou
Talks about:
throughput (1) processor (1) thermal (1) scheme (1) toler (1) small (1) optim (1) multi (1) error (1) delay (1)
Person: Ding-Ming Kwai
DBLP: Kwai:Ding=Ming
Contributed to:
Wrote 3 papers:
- DAC-2012-HuangLTCSCK #3d #testing
- Small delay testing for TSVs in 3-D ICs (SYH, YHL, KHT, WTC, SKS, YFC, DMK), pp. 1031–1036.
- DATE-2011-LungHKC #3d #manycore #online #optimisation #throughput
- Thermal-aware on-line task allocation for 3D multi-core processor throughput optimization (CLL, YLH, DMK, SCC), pp. 8–13.
- DAC-2010-ChangHKCW #3d #fault
- An error tolerance scheme for 3D CMOS imagers (HMC, JLH, DMK, KT(C, CWW), pp. 917–922.