Sergej Deutsch, Krishnendu Chakrabarty
Non-invasive pre-bond TSV test using ring oscillators and multiple voltage levels
DATE, 2013.
@inproceedings{DATE-2013-DeutschC, acmid = "2485548", author = "Sergej Deutsch and Krishnendu Chakrabarty", booktitle = "{Proceedings of the 17th Conference on Design, Automation and Test in Europe}", isbn = "978-1-4503-2153-2", pages = "1065--1070", publisher = "{EDA Consortium San Jose, CA, USA / ACM DL}", title = "{Non-invasive pre-bond TSV test using ring oscillators and multiple voltage levels}", year = 2013, }