Non-invasive pre-bond TSV test using ring oscillators and multiple voltage levels
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Sergej Deutsch, Krishnendu Chakrabarty
Non-invasive pre-bond TSV test using ring oscillators and multiple voltage levels
DATE, 2013.

DATE 2013
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@inproceedings{DATE-2013-DeutschC,
	acmid         = "2485548",
	author        = "Sergej Deutsch and Krishnendu Chakrabarty",
	booktitle     = "{Proceedings of the 17th Conference on Design, Automation and Test in Europe}",
	isbn          = "978-1-4503-2153-2",
	pages         = "1065--1070",
	publisher     = "{EDA Consortium San Jose, CA, USA / ACM DL}",
	title         = "{Non-invasive pre-bond TSV test using ring oscillators and multiple voltage levels}",
	year          = 2013,
}

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