Sergej Deutsch, Krishnendu Chakrabarty
Non-invasive pre-bond TSV test using ring oscillators and multiple voltage levels
DATE, 2013.
@inproceedings{DATE-2013-DeutschC,
acmid = "2485548",
author = "Sergej Deutsch and Krishnendu Chakrabarty",
booktitle = "{Proceedings of the 17th Conference on Design, Automation and Test in Europe}",
isbn = "978-1-4503-2153-2",
pages = "1065--1070",
publisher = "{EDA Consortium San Jose, CA, USA / ACM DL}",
title = "{Non-invasive pre-bond TSV test using ring oscillators and multiple voltage levels}",
year = 2013,
}











