A high-speed design methodology for inductive coupling links in 3D-ICs
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Benjamin J. Fletcher, Shidhartha Das, Terrence S. T. Mak
A high-speed design methodology for inductive coupling links in 3D-ICs
DATE, 2018.

DATE 2018
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@inproceedings{DATE-2018-FletcherDM,
	author        = "Benjamin J. Fletcher and Shidhartha Das and Terrence S. T. Mak",
	booktitle     = "{Proceedings of the 22nd Conference and Exhibition on Design, Automation and Test in Europe}",
	doi           = "10.23919/DATE.2018.8342059",
	isbn          = "978-3-9819263-0-9",
	pages         = "497--502",
	publisher     = "{IEEE}",
	title         = "{A high-speed design methodology for inductive coupling links in 3D-ICs}",
	year          = 2018,
}


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