Jai-Ming Lin, Chien-Yu Huang
General floorplanning methodology for 3D ICs with an arbitrary bonding style
DATE, 2018.
@inproceedings{DATE-2018-LinH,
author = "Jai-Ming Lin and Chien-Yu Huang",
booktitle = "{Proceedings of the 22nd Conference and Exhibition on Design, Automation and Test in Europe}",
doi = "10.23919/DATE.2018.8342197",
isbn = "978-3-9819263-0-9",
pages = "1199--1202",
publisher = "{IEEE}",
title = "{General floorplanning methodology for 3D ICs with an arbitrary bonding style}",
year = 2018,
}