Assembly-Related Chip/Package Co-Design of Heterogeneous Systems Manufactured by Micro-Transfer Printing
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Robert Fischbach, Tilman Horst, Jens Lienig
Assembly-Related Chip/Package Co-Design of Heterogeneous Systems Manufactured by Micro-Transfer Printing
DATE, 2019.

DATE 2019
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@inproceedings{DATE-2019-FischbachHL,
	author        = "Robert Fischbach and Tilman Horst and Jens Lienig",
	booktitle     = "{Proceedings of the 23rd Conference and Exhibition on Design, Automation and Test in Europe}",
	doi           = "10.23919/DATE.2019.8714884",
	isbn          = "978-3-9819263-2-3",
	pages         = "956--959",
	publisher     = "{IEEE}",
	title         = "{Assembly-Related Chip/Package Co-Design of Heterogeneous Systems Manufactured by Micro-Transfer Printing}",
	year          = 2019,
}


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