Andrew B. Kahng, Seokhyeong Kang, Seungwon Kim, Kambiz Samadi, Bangqi Xu
Power Delivery Pathfinding for Emerging Die-to-Wafer Integration Technology
DATE, 2019.
@inproceedings{DATE-2019-KahngKKSX,
author = "Andrew B. Kahng and Seokhyeong Kang and Seungwon Kim and Kambiz Samadi and Bangqi Xu",
booktitle = "{Proceedings of the 23rd Conference and Exhibition on Design, Automation and Test in Europe}",
doi = "10.23919/DATE.2019.8715046",
isbn = "978-3-9819263-2-3",
pages = "842--847",
publisher = "{IEEE}",
title = "{Power Delivery Pathfinding for Emerging Die-to-Wafer Integration Technology}",
year = 2019,
}