Travelled to:
1 × France
Collaborated with:
G.Fettweis N.u.Hassan L.Landau
Talks about:
interconnect (1) wireless (1) level (1) board (1) chip (1)
Person: Erik Fischer
DBLP: Fischer:Erik
Contributed to:
Wrote 1 papers:
- DATE-2013-FettweisHLF
- Wireless interconnect for board and chip level (GF, NuH, LL, EF), pp. 958–963.