Mike Chou, Tom Korsmeyer, Jacob White
Transient Simulations of Three-Dimensional Integrated Circuit Interconnect Using a Mixed Surface-Volume Approach
DAC, 1995.
@inproceedings{DAC-1995-ChouKW,
author = "Mike Chou and Tom Korsmeyer and Jacob White",
booktitle = "{Proceedings of the 32nd Design Automation Conference}",
doi = "10.1145/217474.217575",
isbn = "0-89791-725-1",
pages = "485--490",
publisher = "{ACM Press}",
title = "{Transient Simulations of Three-Dimensional Integrated Circuit Interconnect Using a Mixed Surface-Volume Approach}",
year = 1995,
}