TSV-aware analytical placement for 3D IC designs
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Meng-Kai Hsu, Yao-Wen Chang, Valeriy Balabanov
TSV-aware analytical placement for 3D IC designs
DAC, 2011.

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@inproceedings{DAC-2011-HsuCB,
	author        = "Meng-Kai Hsu and Yao-Wen Chang and Valeriy Balabanov",
	booktitle     = "{Proceedings of the 48th Design Automation Conference}",
	doi           = "10.1145/2024724.2024875",
	isbn          = "978-1-4503-0636-2",
	pages         = "664--669",
	publisher     = "{ACM}",
	title         = "{TSV-aware analytical placement for 3D IC designs}",
	year          = 2011,
}

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