Moongon Jung, Taigon Song, Yang Wan, Yarui Peng, Sung Kyu Lim
On Enhancing Power Benefits in 3D ICs: Block Folding and Bonding Styles Perspective
DAC, 2014.
@inproceedings{DAC-2014-JungSWPL,
author = "Moongon Jung and Taigon Song and Yang Wan and Yarui Peng and Sung Kyu Lim",
booktitle = "{Proceedings of the 51st Annual Design Automation Conference}",
doi = "10.1145/2593069.2593167",
isbn = "978-1-4503-2730-5",
pages = "6",
publisher = "{ACM}",
title = "{On Enhancing Power Benefits in 3D ICs: Block Folding and Bonding Styles Perspective}",
year = 2014,
}