Travelled to:3 × USA
Collaborated with:S.K.Lim D.Z.Pan J.Mitra T.Song Y.Wan Y.Peng
Talks about:reliabl (2) analysi (2) stress (2) mechan (2) chip (2) tsv (2) perspect (1) benefit (1) thermo (1) packag (1)
Person: Moongon Jung
DBLP: Jung:Moongon
Contributed to:
201420122011Wrote 3 papers:
- DAC-2014-JungSWPL #3d #on the #perspective
- On Enhancing Power Benefits in 3D ICs: Block Folding and Bonding Styles Perspective (MJ, TS, YW, YP, SKL), p. 6.
- DAC-2012-JungPL #3d #reliability
- Chip/package co-analysis of thermo-mechanical stress and reliability in TSV-based 3D ICs (MJ, DZP, SKL), pp. 317–326.
- DAC-2011-JungMPL #3d #analysis #optimisation #reliability
- TSV stress-aware full-chip mechanical reliability analysis and optimization for 3D IC (MJ, JM, DZP, SKL), pp. 188–193.