Yi-Chung Chen, Hai Li, Yiran Chen, Robinson E. Pino
3D-ICML: A 3D bipolar ReRAM design with interleaved complementary memory layers
DATE, 2011.
@inproceedings{DATE-2011-ChenLCP, author = "Yi-Chung Chen and Hai Li and Yiran Chen and Robinson E. Pino", booktitle = "{Proceedings of the 15th Conference on Design, Automation and Test in Europe}", isbn = "978-1-61284-208-0", pages = "583--586", publisher = "{IEEE}", title = "{3D-ICML: A 3D bipolar ReRAM design with interleaved complementary memory layers}", year = 2011, }