3D-ICML: A 3D bipolar ReRAM design with interleaved complementary memory layers
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Yi-Chung Chen, Hai Li, Yiran Chen, Robinson E. Pino
3D-ICML: A 3D bipolar ReRAM design with interleaved complementary memory layers
DATE, 2011.

DATE 2011
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@inproceedings{DATE-2011-ChenLCP,
	author        = "Yi-Chung Chen and Hai Li and Yiran Chen and Robinson E. Pino",
	booktitle     = "{Proceedings of the 15th Conference on Design, Automation and Test in Europe}",
	isbn          = "978-1-61284-208-0",
	pages         = "583--586",
	publisher     = "{IEEE}",
	title         = "{3D-ICML: A 3D bipolar ReRAM design with interleaved complementary memory layers}",
	year          = 2011,
}

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