Li Jiang, Qiang Xu, Bill Eklow
On effective TSV repair for 3D-stacked ICs
DATE, 2012.
@inproceedings{DATE-2012-JiangXE,
acmid = "2492905",
author = "Li Jiang and Qiang Xu and Bill Eklow",
booktitle = "{Proceedings of the 16th Conference and Exhibition on Design, Automation and Test in Europe}",
isbn = "978-1-4577-2145-8",
pages = "793--798",
publisher = "{IEEE}",
title = "{On effective TSV repair for 3D-stacked ICs}",
year = 2012,
}