Travelled to:
1 × Germany
1 × USA
2 × France
Collaborated with:
L.Jiang Q.Xu ∅ F.Ye K.Chakrabarty S.K.Sunter A.Osseiran A.Cron N.Jacobson D.Bonnett C.Barnhart B.Bennetts
Talks about:
repair (2) effect (2) stack (2) tsv (2) differenti (1) standard (1) testabl (1) status (1) effici (1) futur (1)
Person: Bill Eklow
DBLP: Eklow:Bill
Contributed to:
Wrote 4 papers:
- DAC-2013-JiangYXCE #3d #effectiveness #on the #performance
- On effective and efficient in-field TSV repair for stacked 3D ICs (LJ, FY, QX, KC, BE), p. 6.
- DATE-2012-JiangXE #3d #effectiveness #on the
- On effective TSV repair for 3D-stacked ICs (LJ, QX, BE), pp. 793–798.
- DATE-DF-2004-Eklow #question #testing
- IP Testing — The Future Differentiator? (BE), pp. 6–9.
- DATE-v2-2004-SunterOCJBEBB #standard #testing
- Status of IEEE Testability Standards 1149.4, 1532 and 1149.6 (SKS, AO, AC, NJ, DB, BE, CB, BB), pp. 1184–1191.