Thermomechanical stress-aware management for 3D IC designs
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Qiaosha Zou, Tao Zhang, Eren Kursun, Yuan Xie
Thermomechanical stress-aware management for 3D IC designs
DATE, 2013.

DATE 2013
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@inproceedings{DATE-2013-ZouZKX,
	acmid         = "2485589",
	author        = "Qiaosha Zou and Tao Zhang and Eren Kursun and Yuan Xie",
	booktitle     = "{Proceedings of the 17th Conference on Design, Automation and Test in Europe}",
	isbn          = "978-1-4503-2153-2",
	pages         = "1255--1258",
	publisher     = "{EDA Consortium San Jose, CA, USA / ACM DL}",
	title         = "{Thermomechanical stress-aware management for 3D IC designs}",
	year          = 2013,
}

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