@inproceedings{DATE-2016-WangTC,
	author        = "Shengcheng Wang and Mehdi Baradaran Tahoori and Krishnendu Chakrabarty",
	booktitle     = "{Proceedings of the 20th Conference and Exhibition on Design, Automation and Test in Europe}",
	ee            = "http://ieeexplore.ieee.org/document/7459509/",
	isbn          = "978-3-9815-3707-9",
	pages         = "1291--1296",
	publisher     = "{IEEE}",
	title         = "{Thermal-aware TSV repair for electromigration in 3D ICs}",
	year          = 2016,
}