Travelled to:
1 × France
1 × Germany
1 × USA
Collaborated with:
G.V.d.Plas P.Marchal J.Balachandran S.Brebels G.Carchon T.Webers W.D.Raedt B.Nauwelaers G.Eneman J.Cho V.Moroz D.Milojevic M.Choi K.D.Meyer A.Mercha T.Hoffmann
Talks about:
model (2) transmiss (1) technolog (1) heterogen (1) configur (1) silicon (1) multipl (1) develop (1) compact (1) analysi (1)
Person: Eric Beyne
DBLP: Beyne:Eric
Contributed to:
Wrote 3 papers:
- DAC-2011-BeyneMP #3d #development #integration
- 3D heterogeneous system integration: application driver for 3D technology development (EB, PM, GVdP), p. 213.
- DATE-2011-EnemanCMMCMMBHP #estimation #multi
- An analytical compact model for estimation of stress in multiple Through-Silicon Via configurations (GE, JC, VM, DM, MC, KDM, AM, EB, TH, GVdP), pp. 505–506.
- DATE-2006-BalachandranBCWRNB #analysis #grid #modelling #power management
- Analysis and modeling of power grid transmission lines (JB, SB, GC, TW, WDR, BN, EB), pp. 33–38.