Travelled to:
1 × USA
Collaborated with:
C.Liu T.Song J.Cho J.Kim S.K.Lim
Talks about:
tsv (2) analysi (1) optim (1) coupl (1) full (1) chip (1)
Person: Joohee Kim
DBLP: Kim:Joohee
Contributed to:
Wrote 1 papers:
- DAC-2011-LiuSCKKL #3d #analysis #optimisation
- Full-chip TSV-to-TSV coupling analysis and optimization in 3D IC (CL, TS, JC, JK, JK, SKL), pp. 783–788.