Used together with:
placement
(1)
consider
(1)
thermal
(1)
Stem
interlay$ (
all stems
)
1 papers:
DAC-2007-GoplenS
#3d
Placement of 3D ICs with Thermal and Interlayer Via Considerations (
BG
,
SSS
), pp. 626–631.
Bibliography of Software Language Engineering in Generated Hypertext
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BibSLEIGH
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Dr. Vadim Zaytsev
.
Hosted as a part of
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