@inproceedings{DAC-2007-GoplenS,
	author        = "Brent Goplen and Sachin S. Sapatnekar",
	booktitle     = "{Proceedings of the 44th Design Automation Conference}",
	doi           = "10.1145/1278480.1278637",
	pages         = "626--631",
	publisher     = "{IEEE}",
	title         = "{Placement of 3D ICs with Thermal and Interlayer Via Considerations}",
	year          = 2007,
}