9 papers:
DAC-2014-ChienHLYC #testing- Contactless Stacked-die Testing for Pre-bond Interposers (JHC, RSH, HJL, KYY, SCC), p. 6.
- DAC-2014-LiuCW #3d
- Floorplanning and Signal Assignment for Silicon Interposer-based 3D ICs (WHL, MSC, TCW), p. 6.
DATE-2014-LiuCW- Metal layer planning for silicon interposers with consideration of routability and manufacturing cost (WHL, TKC, TCW), pp. 1–6.
- DAC-2013-HoC #multi
- Multiple chip planning for chip-interposer codesign (YKH, YWC), p. 6.
HPDC-2013-XuS0 #big data #named- IBIS: interposed big-data I/O scheduler (YX, AS, MZ), pp. 109–110.
- HPDC-2000-AndersonC #network
- Failure-Atomic File Access in an Interposed Network Storage System (DCA, JSC), pp. 157–164.
OSDI-2000-AndersonCV #network #scalability- Interposed Request Routing for Scalable Network Storage (DCA, JSC, AV), pp. 259–272.
SOSP-1993-Jones #interface- Interposition Agents: Transparently Interposing User Code at the System Interface (MBJ), pp. 80–93.
- SOSP-WIP-1991-Jones92 #interface #tool support
- A Toolkit for Interposing User Code at the System Interface (Abstract) (MBJ), p. 21.
