Floorplanning and Signal Assignment for Silicon Interposer-based 3D ICs
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Wen-Hao Liu, Min-Sheng Chang, Ting-Chi Wang
Floorplanning and Signal Assignment for Silicon Interposer-based 3D ICs
DAC, 2014.

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@inproceedings{DAC-2014-LiuCW,
	author        = "Wen-Hao Liu and Min-Sheng Chang and Ting-Chi Wang",
	booktitle     = "{Proceedings of the 51st Annual Design Automation Conference}",
	doi           = "10.1145/2593069.2593142",
	isbn          = "978-1-4503-2730-5",
	pages         = "6",
	publisher     = "{ACM}",
	title         = "{Floorplanning and Signal Assignment for Silicon Interposer-based 3D ICs}",
	year          = 2014,
}

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