Metal layer planning for silicon interposers with consideration of routability and manufacturing cost
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Wen-Hao Liu, Tzu-Kai Chien, Ting-Chi Wang
Metal layer planning for silicon interposers with consideration of routability and manufacturing cost
DATE, 2014.

DATE 2014
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@inproceedings{DATE-2014-LiuCW,
	author        = "Wen-Hao Liu and Tzu-Kai Chien and Ting-Chi Wang",
	booktitle     = "{Proceedings of the 18th Conference and Exhibition on Design, Automation and Test in Europe}",
	doi           = "10.7873/DATE.2014.372",
	pages         = "1--6",
	publisher     = "{IEEE}",
	title         = "{Metal layer planning for silicon interposers with consideration of routability and manufacturing cost}",
	year          = 2014,
}


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